Heat dissipation solution for communication equipment using tough pitch copper.
Improve heat dissipation with a Ra0.1 surface roughness! Optimize the performance of communication devices!
In the telecommunications industry, as performance increases, heat dissipation measures have become an important issue. In particular, electronic components that are densely mounted face a higher risk of performance degradation and failure due to heat. Tough pitch copper has high thermal conductivity, but its difficulty in processing can make it challenging to achieve optimal heat dissipation solutions. Our company utilizes advanced microfabrication technology for tough pitch copper to achieve a surface roughness of Ra0.1, thereby maximizing heat dissipation performance. This contributes to improving the reliability of communication devices. 【Application Scenarios】 * Base stations * Servers * Communication modules * Other communication devices requiring heat dissipation 【Benefits of Implementation】 * Extended equipment lifespan * Stabilized performance * Reduced risk of failure
- Company：萬代 本社
- Price：Other
